A method of aligning a semiconductor wafer alignment mark and

A method of aligning a semiconductor wafer, comprising the steps of: - providing a semiconductor wafer (10) comprising a substrate (5), - forming a structure with raised structural elements (12a) on the surface of the substrate (5) of the semiconductor wafer (10), - depositing at least one layer (14) having a predetermined thickness on the surface of the substrate (5) of the semiconductor wafer (10) and on the structure, - planarizing the layer (14) to form a planarized surface (32), - applying a resist (18) - aligning the semiconductor wafer (10) relative to a projection apparatus for exposing the resist (18), characterized in that - at the step of forming the structure at least two further an alignment mark representing structural elements (12b) spaced from each other on the surface of the substrate (5) of the semiconductor wafer (10) are formed, - subsequently a further resist (24) is deposited, - the further resist (24) in a region between the two other structure elements ...