Method for reducing secondary electron emission coefficient on silver-plated surface of aluminum alloy

The invention provides a method for reducing a secondary electron emission coefficient on silver-plated surface of aluminum alloy. The method comprises the following steps: (1) carrying out ultrasonic cleaning with an acetone solution on the interior surface of an aluminum alloy microwave component for 10 min and then carrying out ultrasonic cleaning with an ethanol solution for 10 min; (2) cleaning the cleaned interior surface of the aluminum alloy microwave component with a NaOH solution having a concentration of 50 g/L and a temperature of 50 DEG C for 1 min so as to remove an oxide film on the surface of the aluminum alloy; (3) treating the aluminum alloy microwave component with ferric trichloride having a concentration of 5 g/L and a hydrochloric acid mixed solution having a concentration of 10 g/L for 3 min at a temperature of 40 DEG C; (4) sputtering a layer of copper on the interior surface of the aluminum alloy microwave component; and (5) sputtering a layer of silver on the surface of copper. The method provided by the invention can effectively reduce the secondary electron emission coefficient on the silver-plated surface of the aluminum alloy.