Compactly Packaged High-Speed Optical Transceiver Using Silicon Photonics ICs on Ceramic Submount

High-speed optical module is demonstrated using silicon photonics integrated circuits (Si-PIC) by compact packaging on ceramic submount of which size is 4 mm x 21 mm x 1.1 mm. The electronic integrated circuits (EIC) such as transimpedance amplifier (TIA) for photodetector and driver IC for modulator are flip-chip bonded on the submount using 1 mil diameter of Au stud bumps. The optical transceiver is packaged through the flip-chip bonding of the packaged submount by SAC solders on the evaluation PCB on which RF signal transmission lines are precisely designed. The reliable flip-chip bonding state of the EICs and submount are verified through shear test and x-ray image. Eye diagram is demonstrated at 20 Gbps for receiver module.