A heat induced bi-layer lift-off method for flexible substrates

This paper presents a microfabrication method that uses the reflow (i.e., heat induced photoresist deformation) of bi-layer sacrificial photoresists to allow rapid, complete lift-off of thick films on a flexible substrate. The simplicity and versatility of the method allows lift-off processing of thick films (> 50% thicker than the undercut photoresist layer) for the fabrication of low-electrical-resistance components in MEMS devices for applications such as thermoelectric power generation and sensing.