Effects of Current Crowding and Joule Heating on Reliability of Solder Joints

This study employs three‐dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip‐chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot‐spot may play important role in the void formation and thermomigration in solder bumps during electromigration.