The method of manufacturing a copper alloy sputtering target and the copper alloy sputtering target

Copper alloy sputtering target of the present invention is composed of a copper alloy, a copper alloy, the Ca content is 0.3 mass% to 1.7 mass%, the total content of Mg and Al is 5 ppm by mass or less, an oxygen content of 20 ppm by mass or less, the balance being Cu and inevitable impurities. The method of manufacturing a copper alloy sputtering target of the present invention includes: a purity of 99.99% by mass of copper step; inert gas atmosphere or reducing gas atmosphere, the high frequency melting in a crucible to obtain a copper step of the molten copper; Add the molten copper in a purity of more than 98.5% by mass of Ca and allowed to melt and the component adjustment, a step to make it molten metal having a predetermined component composition; said composition having a predetermined composition in the molten metal cooling the mold to obtain a casting of an ingot; and after hot rolling the ingot, annealing stress relief step.