Magnetic material sputtering target and manufacturing method for same

A magnetic material sputtering target characterized in that at least 60% of a surface for observing oxides in the target is constituted by oxide particles such that in the observed surface of the target, the average particle size of the oxide particles is 1.5 µm or less, and if the maximum diameter is the value between the two points on the outer periphery of an oxide particle with the maximum distance therebetween, and the minimum diameter is the value between the two parallel straight lines that sandwich the particle with the minimum distance therebetween, then the difference between the maximum diameter and the minimum diameter is 0.4 µm or less. The obtained magnetic material sputtering target having non-magnetic material particles dispersed therein is capable of suppressing abnormal electrical discharge by the oxide, which is a cause of particle generation during sputtering.