A Model to Predict Transient Dielectric-Charging Effects in RF MEMS Capacitive Switches

Abstract : Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging methods for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.