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Crack initiation and growth in WLCSP solder joints
Crack initiation and growth in WLCSP solder joints
2011
Robert Darveaux
Sabira Enayet
Corey Reichman
Christopher J. Berry
Nabeel Zafar
Keywords:
Chip-scale package
Soldering
Temperature cycling
Crack closure
Composite material
Materials science
Correction
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