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Nabeel Zafar
Nabeel Zafar
Amkor Technology
Materials science
Composite material
Chip-scale package
Soldering
Crack closure
2
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18
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Crack initiation and growth in WLCSP solder joints
2011
ECTC | Electronic Components and Technology Conference
Robert Darveaux
Sabira Enayet
Corey Reichman
Christopher J. Berry
Nabeel Zafar
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Citations (13)
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