Beyond advanced FDSOI: Low Temp SmartCut for enabling High Density 3D SoC applications

Internet of Thing (IoT), wearable electronics and Automotive are big drivers for the growth of semiconductor market after the smartphone era. To achieve complex but miniaturized, ultra-low power but highly reliable circuits; to maintain sufficient performance and cost-effective solutions, planar Fully Depleted SOI (FDSOI) on ultra-thin Buried Oxide (BOX) demonstrate benefits & capabilities. [1] Beyond already production released Fully-Depleted technologies, advanced SOI products are developed to pursue Digital roadmap from planar devices to 3D integration.