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Residual Stress Properties of Nickel and Copper Deposits Used for C4 Interconnects
Residual Stress Properties of Nickel and Copper Deposits Used for C4 Interconnects
2011
Charles L. Arvin
George J. Scott
Charles Goldsmith
Christopher Parks
Chen Wang
Yun Zhang
Joe Abys
Ken Takahashi
Keywords:
Copper
Metallurgy
Nickel
Materials science
Residual stress
Correction
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