Polyamideimide resins, adhesives, flexible board materials, flexible laminate and flexible printed wiring board
2007
A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol% or more of a compound represented by the following general formula (1) and 20 mol% or more of a compound represented by the following general formula (2).
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