Flip Chip Wafer Level Packaging of a flexible Chip Scale package (CSP)

The advent of Chip Scale Packages (CSP) within the semiconductor community has led to the development of Wafer Scale Assembly (WSA) or Wafer Level Packaging (WLP) manufacturing in order to raise assembly efficiencies and lower operating costs. Texas Instruments (TI) has developed a unique WLP process for forming flip chip, ball grid array packages. The die inputs and outputs of the TI CSP are connected through solder bumps to a polyimide film interposer. Solder balls on the other side of the interposer complete the electrical connection to a customer's printed circuit board. A wafer-sized array of interposers designed to match the pattern of dies on a wafer is aligned and reflowed to a bumped wafer. The TI WLP process is completed by singulating the CSP's from the wafer using standard wafer saw equipment. Attachment of the interposer to the die as well as applying the die and board level solder bumps are carried out in wafer form using a new bumping technology called Tacky Dots . Tacky Dots uses an array of sticky dots formed in a photosensitive coating laminated to a polyimide film for transferring and attaching solder spheres to semiconductor substrates. A populated film containing one solder sphere per tacky dot is positioned over the wafer or interposer and lowered until the spheres contact the pads. A reflow process transfers the spheres from the film to the wafer or interposer and the film is removed once the spheres have frozen. This paper illustrates the process steps and custom equipment developed for forming the TI CSP. The strategic use of finite element modeling for optimizing the design of the package is outlined. The paper concludes by summarizing the current package level reliability results.