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Greg Hotchkiss

Texas Instruments

7

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Effects of probe damage on wire bond integrity

2001 ECTC | Electronic Components and Technology Conference
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Wafer level packaging of a tape flip-chip chip scale packages

2001 Microelectronics Reliability
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Rapid Cure Process (RCP) for CerDIP Packages Using Tungsten-Halogen Lamps

1996
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Particle Generation of Silver-Glass Die Attaches During a Rapid Cure Process (RCP)

1996
- Greg Hotchkiss
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