An apparatus for sputter coating with plasma potential variierbarem

An apparatus for sputter coating with variierbarem Plasmapotiential with a vacuum chamber, a double magnetron is in the opposite of a substrate disposed, the individual magnetrons are potientialfrei connected to the output of a bipolar power supply, and in an applied with an auxiliary voltage auxiliary electrode is disposed, characterized in that auxiliary electrode (5) at least in a plasma space between the individual magnetrons (3.1; 3.2) and the substrate (2) is arranged such that it extends beyond the double magnetron (3) towards the substrate (2) and up to a distance from the substrate ( 2) extends to and is biased with the boosted voltage with respect to ground.