Sputtering device, sputtering method and photomask blank

SOLUTION: A sputtering device includes a chamber, a sputtering target and a shield provided along an inner wall of the chamber, and has the sputtering target and a substrate arranged in a sputtering space inside the shield, for forming a thin film on the substrate. The chamber and the substrate are arranged offset to each other, and a vertical plane passing through a center of a sputtering surface of the sputtering target, which is also a plane formed by intersecting a normal line passing through a center of a sputtered surface of the substrate with a perpendicular line from a center of the sputtering surface, is defined as a virtual plane, and a region on the virtual plane or on the substrate side than the virtual plane is set as a substrate-side region. Then, sputtering is performed after arranging the entire side surface shield positioned in the substrate-side region in such a manner that the distance from the center of the sputtering surface thereto becomes further than the offset distance as the shortest distance of the normal line passing from the center of the sputtering surface to the center of the sputtered surface.EFFECT: Film forming due to deposition of sputtering particles on a shield can be effectively prevented, and defects caused by particles generated by peeling of the film can be reduced.SELECTED DRAWING: Figure 3