Semiconductor device package having multi-chips with side-by-side configuration and method of the same

The present invention provides a semiconductor device package with the die receiving through hole and connecting through hole structure comprising a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad. A die is disposed within the die receiving through hole. An adhesion material is formed under the die and filled in the gap between the die and sidewall of the die receiving though hole. Further, a wire bonding is formed to couple to the bonding pads and the first contact pad. A dielectric layer is formed on the wire bonding, the die and the substrate. A second contact pad is formed at the lower surface of the substrate and under the connecting through hole structure.