Silicon Photonic Based Stacked Die Assembly for 4×200-Gbit/s Short-Reach Transmission

Ying Zhao,Li Chen,R. Aroca,Ninghui Zhu,Dinh Ton,David Inglis,Christopher R. Doerr

Silicon Photonic Based Stacked Die Assembly for 4×200-Gbit/s Short-Reach Transmission

2021

Ying Zhao
Li Chen
R. Aroca
Ninghui Zhu
Dinh Ton
David Inglis
Christopher R. Doerr

We present a silicon photonic based stacked die assembly with driver and transimpedance amplifier for 4×200-Gbps applications. Various 200-Gbps pulse amplitude modulation formats over 2 and 10.5-km transmissions are demonstrated and compared.

Keywords:

Materials science
Amplitude modulation
Pulse-amplitude modulation
Silicon
Silicon photonics
Die (integrated circuit)
Optoelectronics
Optical amplifier
Photonics
Transimpedance amplifier

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