Semiconductor assembly packaging structure with a plurality of grains and packaging method thereof

The invention relates to a semiconductor assembly packaging structure with a plurality of grains and a packaging method thereof. The semiconductor assembly packaging structure with the plurality of grains of the invention comprises a substrate which has a grain receiving through hole and an electric connection through hole structure, wherein the electric connection through hole structure is coupled with a first contact pad on the upper surface of the substrate and a second contact pad on the lower surface of the substrate; a first gain with a first bonding pad is arranged in the grain receiving through hole; a first bonding material is formed below the first grain, while a second bonding material is filled in a space between the first grain and the side wall of the grain receiving through hole; a first lead is formed to couple the first bonding pad and the first contact pad; a second grain with a second bonding pad is attached on the first gain; a second lead is formed to couple the second bonding pad and the first contact pad; and a plurality of dielectric layers are formed on the first lead, the second lead, the first grain, the second grain and the substrate.