An apparatus for picking, placing and pressing semiconductor components

An apparatus (10) for picking and placing or for picking and transferring or for picking, placing and pressing semiconductor components is disclosed. The apparatus (10) comprises a motor for generating power to rotate a turret (6) which holds a plurality of pick-up heads (7), a plurality of pressers (8) which are a plurality of voice coil assemblies (3) consisting of voice coil actuator assemblies (31), at least one stationary frame (1, 2) to secure the voice coil assemblies (3) and a controller means to control the direction and magnitude of displacement of the voice coil actuator assemblies (31). When current flows into voice coil in the voice coil actuator assembly (31), electromagnetic force is generated in vertical direction, forcing the actuators to press the pick-up heads (7) located directly below the actuators at a particular moment, which in turn reaches to and press on wafers or semiconductor components located below the pick-up heads. The pressing force, speed and direction of each actuator can be controlled individually. Furthermore, this invention includes safety measures wherein a real time actuator position feedback system is used to confirm the displacement of the actuators and an urging device (35) is used to return the actuators back to their original position in the event of power outage.