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Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology
Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology
2011
Rudolf Schlangen
Shinobu Motegi
Toshi Nagatomo
Christian Schmidt
Frank Altmann
Hiroaki Murakami
Stewart Hollingshead
John West
Keywords:
System in package
Optoelectronics
Thermography
non destructive
Materials science
Correction
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