ESD protection elements during hbm stress tests—further numerical and experimental results

Correlation problems for HBM-ESD testing result from the complex interaction between device and tester. The HBM stresses of different well-characterized testers 1,2 are applied to protection elements. By means of circuit simulations and in situ measurements, snapback and second breakdown during HBM are investigated. For fast transient events, a new transmission line approach of the tester improves the correlation between experiment and simulation.