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Parametric Study of Low-k Layer Stress for a Flip-Chip Chip Size Package Using a Copper Pillar Bump
Parametric Study of Low-k Layer Stress for a Flip-Chip Chip Size Package Using a Copper Pillar Bump
2016
Cha Gyu Song
Hoon Sun Jung
Eun Sook Sohn
DaeByoung Kang
Jin-Young Kim
Juhoon Yoon
Choonheung Lee
Sung Hoon Choa
Keywords:
Parametric statistics
Materials science
Thermal copper pillar bump
Composite material
Chip
Flip chip
chip size
Correction
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