Planarization method and planarization apparatus

Planarization method, even if the initial step is formed on the surface of the metal film as a wiring material, the surface of the metal film over the entire surface, yet it can be polished flat with sufficient processing speed. This planarization method, upon flattening by processing the metal film surface having an initial step formed on the workpiece, cover only the recess that forms the initial step of the metal film surface with a solid or pasty coating material and, processing the metal film surface by electrochemical machining using no abrasive.