INFLUENCE OF CURE TEMPERATURE ON THE INTERFACIAL BEHAVIOR OF CARBON FIBRE/EPOXY MATRIX

2014 
Analytical study was performed to determine the interface behavior affected by interfacial properties and the thermal residual stress.A cohesive zone model governed by the elastic-softening law for the fiber/matrix interface was used to simulate the thermal residual stress developed during the curing process and the fiber axial stress during fragmentation process.The interfacial properties of carbon fiber/epoxy resin cured either at room temperature or at high temperature were obtained.The results indicates that,compared with the room temperature curing,after high temperature curing,the interfacial shear strength increases slightly,and the interfacial fracture toughness increases significantly.The interface softening appears early,but the interface debonding is delayed after high temperature curing.In addition,both the fiber axial and interfacial radial thermal residual stresses delay the interface softening,and the interface debonding is delayed by the interfacial radial thermal residual stress.
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