Conductive paste, a multilayer board and a manufacturing method thereof using the same

Conductivity, adhesion to the substrate, and excellent in these long-term stability, when used in the through-hole filling of the multilayer substrate, in order to improve the reliability of the bonding between the conductive layer end surface of the through hole, through providing an unnecessary conductive paste hole plating. Its conductive paste, (A) acrylate resin and per 100 parts by weight of the resin component containing an epoxy resin, (B) a melting point of 180 ° C. or less of the low-melting-point metal at least one and a melting point 800 ° C. or more refractory metal at least one metal powder 200-1800 parts by weight of two or more metals, including bets, (C) a curing agent 0.5 to 40 parts by weight comprising from 0.3 to 35 parts by weight phenolic curing agent, and (D) a flux 0 and those comprising .3～80 parts.