Silicon/silicon oxide and silicon/silicon nitride multilayers for XUV optical applications
1991
Si/Si02 and Si/Si3N4 multilayers have been fabricated using a locally made reactive diode if-sputtering systern.
'Ihe layer alternation is obtained by modulating a partial pressure of oxygen or nitrogen near the sample using
a silicon target and argon as sputtering gas. 02 and N2 partial pressure conditions were optimized to deposit
stoechiornetric Si02 and Si3TV4 films without significant reaction with the silicon target. In-situ kinetic ellipsometry
was used to monitore both thick film and multilayer deposition. 'I'he different interfaces appear very sharp with
a little contamination of the silicon layers especially using oxygen. The multilayers were characterized by gazing
X-ray reflection ( Cu - K line ), and the reflectivity was measured in the soft X-ray range (120 - 350 A ) by
synchrolroii radiation. BotI1 Si/Si02 and SiIS13N4 multilayers exhibit well defmed Bragg peaks with very narrow
bandpasses ( two to three times lower than the conventional M'/Si multilayer ),and high absolute reflectivities (up
to 22% at 1 30 A ). The soft X-ray performances of these mirrors are explained using the physical characteristics
deduced from kinetic ellipsometry, grazing X-ray reflection, infrared absorption and transmission electron
microscopy measurements.
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