Nickel-platinum alloy target with copper alloy back plate and preparation method thereof

The invention relates to a preparation method of a nickel-platinum alloy target with a copper alloy back plate. The preparation method comprises the following steps in sequence: machining the surfaces of a nickel-platinum alloy target blank with platinum content of 5-20at.% and a copper alloy plate blank and then chemically cleaning the nickel-platinum alloy target blank and the copper alloy plate blank; putting the copper alloy plate blank and the nickel-platinum alloy target blank in a sleeved container in sequence, then soldering and sealing the sleeved container and soldering an air outlet pipe on the sleeved container; vacuumizing the sleeved container via the air outlet pipe and then sealing the air outlet pipe by soldering; then carrying out hot isostatic pressing treatment; then removing the sleeved container and machining the nickel-platinum alloy target blank and the copper alloy plate blank, which are soldered into a whole, thus obtaining the nickel-platinum alloy target with the copper alloy back plate. The nickel-platinum alloy target and the preparation method have the advantages that soldering is carried out by using the hot isostatic pressing technology which is simple in process via atomic diffusion; the nickel-platinum alloy target with the copper alloy back plate, which is obtained via diffusion soldering, is suitable for high-power sputtering coating.