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Chemical Mechanical Planarization of Cu: Nanoscale Processes
Chemical Mechanical Planarization of Cu: Nanoscale Processes
2002
Michael B. Arthur
Kelly Fishbeck
Kara Muessig
J. Andrew McDonald
Christine Williams
Daniel M White
Deborah C. Koeck
Scott S. Perry
Heather Claire Galloway
Keywords:
Nitric acid
Corrosion inhibitor
Atomic force microscopy
Nanoscopic scale
Copper
Chemical-mechanical planarization
Materials science
Integrated circuit
Surface charge
Inorganic chemistry
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