Thin films: Stresses and mechanical properties; Proceedings of the Symposium, Boston, MA, Nov. 28-30, 1988

The preparation, properties, and applications of thin films are discussed in reviews and reports. Sections are devoted to testing and measurement techniques, heteroepitaxy, fracture and related failure mechanisms, and the mechanical properties of thin films. Particular attention is given to determination of thin-film stresses by X-ray diffraction, wafer-curvature techniques for stress measurement in thin films, defects in ordered ternary semiconductor epilayers, strain relief by tilting of epitaxial GaAs films on Si, tailored microstructures to control interfacial toughness, stress gradients and anisotropy in thin films, intrinsic stress in a-Ge films deposited by RF-magnetron sputtering, and the effects of stress on the adhesion of metals to polyimides.