Thermal characterization of three-dimensional printed components for light-emitting diode lighting system applications

This study investigated the thermal properties of three-dimensional (3-D) printed components with the potential to be used for thermal management in light-emitting diode (LED) applications. Commercially available filament materials with and without a metal filler were characterized with changes to the print orientation. 3-D printed components with an in-plane orientation had >30  %   better effective thermal conductivity compared with components printed with a cross-plane orientation. A finite-element analysis was modeled to understand the effective thermal conductivity changes in the 3-D printed components. A simple thermal resistance model was used to estimate the required effective thermal conductivity of the 3-D printed components to be a viable alternative in LED thermal management applications.