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A Novel Compact Antenna with a Low Profile Demonstrated on Embedded Wafer Level Packaging (EMWLP) Technology
A Novel Compact Antenna with a Low Profile Demonstrated on Embedded Wafer Level Packaging (EMWLP) Technology
2011
Lim Ying Ying
Ho Soon Wee David
Chong Ser Choong
Myo Ei Pa Pa
Lim Teck Guan
Keywords:
Wafer-level packaging
Wafer backgrinding
Front and back ends
Embedded Wafer Level Ball Grid Array
Optoelectronics
Materials science
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