Dry etching of low k materials

The introduction of low k materials has introduced the need for new dry etch processes. The requirements for these dry etch processes are reviewed. Basic etch characteristics, under both afterglow and RIE conditions, for different low k polymers are discussed. The etch recipes were tested for use in dual damascene back end schemes. The most important issues are briefly discussed. Fine tuning of the etch processes must go hand in hand with further development of the back end integration schemes.