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Low contact-resistance metallization process for a nickel self-aligned contact of beyond 65nm node CMOS ISSM Paper: PO-O-039
Low contact-resistance metallization process for a nickel self-aligned contact of beyond 65nm node CMOS ISSM Paper: PO-O-039
2007
Takuya Futase
Naoto Hashikawa
Takeshi Hayashi
Hiroshi Tobimatsu
Hirohiko Yamamoto
Hidehiko Kozawa
Keywords:
CMOS
Electronic engineering
Nickel
Contact resistance
Materials science
Optoelectronics
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