Semisolidified sheet, printed wiring board, multilayer printed wiring board and method for manufacturing the same

The present invention relates to a printed wiring board with a prepreg, which comprises a fluorocarbon fibers as a reinforcing material, and the reinforcing material impregnated with resin. The fluorocarbon fibers contain short fibers having a branched structure. The reinforcing material interleaved by the fluorocarbon fibers in the thickness direction of the nonwoven fabric. Ratio of the fibers constituting the nonwoven fabric are fluorocarbon fibers is 50 wt% to 100 wt%, the remaining synthetic fibers or inorganic fibers. The non-woven fabric at a temperature range of 390 to 330 ℃ deg.] C heat treatment and then subjected to an annealing treatment at a temperature range of 270 to 200 ℃ deg.] C, and the nonwoven fabric impregnated with resin. Thereby providing a clearance having a low connection resistance and vias connecting the printed wiring board prepreg stability, and a manufacturing method for the printed wiring board.