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Evaluation of CMP-Cu interconnects prepared with CVD and with sputter-reflow
Evaluation of CMP-Cu interconnects prepared with CVD and with sputter-reflow
1996
M. Hoshino
N. Misawa
K. Kakuta
N. Ohsako
S. Okamoto
T. Ohba
H. Yagi
M. Yamada
Y. Furumura
Keywords:
Electromigration
Metallurgy
Sputtering
Materials science
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