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Wafer Scale Cu Plating Process Optimization for Defectivity Improvement
Wafer Scale Cu Plating Process Optimization for Defectivity Improvement
2014
Shafaat Ahmed
Qiang Huang
Tien Cheng
Paul Findeis
Craig R Gruszecki
Andrew H. Simon
P. McLaughlin
Naftali E. Lustig
Edward Engbrecht
Mark N Lakritz
Pei I Wang
Christa L Montgomery
S. Mittal
F. Baumann
Connie-Nga Truong
Brett Baker-ONeal
Sarah L. Grunow
Michael P. Chudzik
Stephan Grunow
Keywords:
Manufacturing engineering
Process optimization
Wafer
Artificial intelligence
Materials science
Process engineering
Computer science
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