Development and characterization of ultra high aspect ratio microstructures made by ultra deep X-ray lithography

Abstract A technique of casting of thick pre-polymer layers was developed based on the proposed model of diluent evaporation. For the first time, microstructures with 7 mm height and up to 18 microns wide (an aspect ratio of up to 389) were manufactured by means of ultra deep X-ray lithography in a cured pre-polymer that can be functionalized. The microstructures were characterized. The difference in the size of patterned microstructures and their initial size on the X-ray mask decreases to 400 nm with the lessening lateral dimension of the microstructures from 1500 to 18 μm. The sidewall roughness also decreases to 20 nm.