Thermoelectric module design to improve lifetime and output power density

Abstract In a traditional thermoelectric π-type module, there is severe thermal stress at the hot side due to the thermal expansion of the hot-side ceramic plate and the mismatch between the coefficient of thermal expansion values among the different components, resulting in the likely development of permeant strain in the module, which leads to short lifetime. In this study, a new module design is proposed to reduce the thermal stress and enhance the lifespan of the module by 68%. Simulation using COMSOL 5.4 Multiphysics software confirmed the advantage. For a given module size, the new design has also a positive effect on the output performance of the thermoelectric module. Such an improvement may be implemented in future module manufacturing for improved performance.