Preparation of multicomponent thin films by magnetron co-sputtering method: The Cu-Ti case study

Abstract The paper discusses the preparation of multicomponent thin films of Cu-Ti composite with desired elemental composition using the pulsed magnetron co-sputtering technology. The technological goal described in the paper was deposition the Cu-Ti composite with elemental ratio of about 50/50 at%, which is close to the eutectic point from the Cu-Ti alloy system. A large difference in the sputtering yield (about seven-fold) of Cu and Ti metals was challenging, because of the features of used power supplies. Desired concentrations of the Ti and Cu elements were obtained as a result of application of multimagnetron sputtering system, where magnetrons were equipped with the Ti or Cu targets. Additionally, pulse power supply was used together with the pulse width modulation controller. Moreover, the article presents investigations of structural and mechanical properties of deposited Cu, Ti and Cu-Ti films with elemental composition of ca. 50/50 at.%. It was found that the two component Cu 0.5 Ti 0.5 thin films were composed of Cu 4 Ti 3 nanocrystallites built-in an amorphous matrix. As compared to the pure Cu and Ti thin films, the prepared composite exhibited improved hardness and better elasticity reflected in lower values of the Young's modulus. The results of nanoindentation investigations showed that the Cu 0.5 Ti 0.5 composite thin film was characterized by the hardness of 7.59 GPa.