Magnetron sputtering device and magnetron sputtering method

The present invention provides a magnetron sputtering device and a magnetron sputtering method. The magnetron sputtering device comprises a reaction chamber, a sputtering power supply and a driving source, a target is arranged at the top of the reaction chamber, and the sputtering power supply is electrically connected with the target, and is used to output a sputtering power to the target during the magnetron sputtering process. A pedestal is arranged in the reaction chamber, is located below the target, and is used to bear a processed workpiece. The driving source is used to drive the pedestal to rise or drop. Moreover, the magnetron sputtering device also comprises a control unit used for controlling the driving source to drive the pedestal to rise during the magnetron sputtering process, so that the spacing between the target and the pedestal is always kept at a predetermined value and does not change. The magnetron sputtering device provided by the present invention uses the control unit to control the driving source to drive the pedestal to rise during the magnetron sputtering process, so that the spacing between the target and the pedestal is always kept at the predetermined value, does not change, and is always kept at an optimal value, and accordingly, the thin film uniformity and deposition rate can be improved.