Sputtering coating device
1992
PURPOSE: To provide a means suitable for depositing a filter on a lump by sputtering substance to a substrate by a primary device and applying another plasma to the plasma formed by the primary device by a secondary device. CONSTITUTION: The inside of a vacuum vessel 1 is provided with a mounting- moving means 2, and a substrate 3 is moved thereon. A primary device which is at least one magnetron sputtering device 5 is arranged on an operating part close to a substrate holder, and at least one kind of selected substance is sputtered to the substrate 3. Another plasma is applied by at least one auxiliary plasma generating device 6 of a secondary device for increasing the plasma 11 formed by the primary device 5. In this way, safe oxide can economically be deposited on the product. COPYRIGHT: (C)1993,JPO
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