Gate oxide reliability concerns in gate-metal sputtering deposition process: an effect of low-energy large-mass ion bombardment

Abstract The effects of ion species/ion bombardment energy in sputtering deposition process on gate oxide reliability have been experimentally investigated. The use of xenon (Xe) plasma instead of argon (Ar) plasma in tantalum (Ta) film sputtering deposition for gate electrode formation makes it possible to minimize the plasma-induced gate oxide damage. The Xe plasma process exhibits 1.5 times higher breakdown field and five times higher 50%-charge-to-breakdown ( Q BD ). In the gate-metal sputtering deposition process, the physical bombardment of energetic ion causes to generate hole traps in gate oxide, resulting in the lower gate oxide reliability. The simplified model providing a better understanding of the empirical relation between the gate oxide damage and the ion-bombardment energy to gate oxide in gate-metal sputtering deposition process is also presented.