A monolithic 9 degree of freedom (DOF) capacitive inertial MEMS platform

A monolithic 9 degree of freedom capacitive inertial MEMS platform is presented in this paper. This platform for the first time integrates 3 axis gyroscopes, accelerometers, and Lorentz Force magnetometers together on the same chip without using any magnetic materials. This reduces the assembly cost, and fully eliminates the need of magnetic material processing and axis misalignment calibration. The fabricated sensors, vacuum packaged (vacuum ∼100mTorr) at wafer level with epi-polysilicon through silicon interposer (TSI) wafer using eutectic bonding, performed within 10% of the simulation results.