Silicon photonics technology enables compact, low-power and cost-effective optical microsystems on a chip by leveraging the materials and advanced fabrication methods developed over decades for integrated silicon electronics. Silicon foundries now provide many standard building blocks required for high-performance optical circuits, including passive components such as optical waveguides, filters and (de-)multiplexors and active optoelectronic components such as high-speed modulators, switches and photodetectors. However, because silicon is a poor light emitting material, on-chip light sources are still a significant challenge for foundry offerings. Current light-source integration methods are viewed as complex, requiring incompatible and/or expensive materials and processing steps. Here we report on an ultra-compact silicon photonic laser consisting of a thulium-silicon hybrid microdisk resonator. The microdisk design is straightforward and compatible with the fabrication steps and device dimensions available in all silicon photonics foundries, whereas the gain medium is added in a backend (final step), room temperature sputter deposition. This approach allows for low-cost and high-volume wafer-scale manufacturing and co-integration of light sources with silicon passive and active devices with no adjustment to standard process flows. The hybrid laser is pumped at standard telecom wavelengths around 1.6 {\mu}m and emits around 1.9 {\mu}m, which is within an emerging spectral region of significant interest for communications, nonlinear and quantum optics, and sensing on silicon.
In this article, we report a Si/Ge waveguide phototransistor with high responsivity and low dark current under low bias voltages, due to an engineered electric field distribution. The photodetector consists of n-i-p-i-n doping regions and shows a responsivity of 606 A/W at 1 V bias, and 1032 A/W at 2.8V bias with an input optical power of −50 dBm, and dark current of 4 µA and 42 µA respectively. This is achieved by placing two p + -doped regions in the silicon slab region beneath the Ge epitaxial layer. A measured small signal −3 dB bandwidth of 1.5 GHz with a −80 dBc/Hz phase noise response at 1 KHz frequency offset were demonstrated experimentally.
We report the measurement of optical loss in submicron silicon-on-insulator waveguides at a wavelength of 2.02 μm for the fundamental TE mode. Devices were fabricated at IMEC and at ASTAR's Institute of Microelectronics (IME) and thus these measurements are applicable to studies which require fabrication using standard foundry technology. Propagation loss for strip and rib waveguides of 3.3 ± 0.5 and 1.9 ± 0.2 dB cm−1 were measured. Waveguide bending loss in strip and rib waveguides was measured to be 0.36 and 0.68 dB per 90° bend for a radius of 3 μm. Doped waveguide loss in rib waveguides was measured for both n-type and p-type species at two doping densities for each doping type. Measured results from propagation, bending, and free-carrier loss were found to be in good agreement with analytical or numerical models. Loss due to lattice defects introduced by ion-implantation is found to be underestimated by a previously proposed empirical model. The thermal annealing of the lattice defects is consistent with removal of the silicon divacancy.
We report on a series of experiments in which a strained Si 0.95 Ge 0.05 layer 600A thick was oxidized along with relaxed SiGe layers and Si samples. In this work, we observed that the oxidation rate of the strained SiGe layer is always much higher than the relaxed model expectations. We also observed that the rate is higher than that of relaxed SiGe layers with higher Ge concentration oxidized at similar temperatures. We attributed this increase in the rate of oxidation to the effect of strain in the SiGe layer. To confirm our hypothesis, we oxidized strained SiGe layers together with relaxed SiGe layers of higher concentration. We observed that the strained SiGe layer compared with relaxed sample has a thicker oxide despite the lower Ge concentration. We conclude that the strain in the SiGe layer causes a further increase in the oxidation rate.
In this paper we present SOI, suspended Si, and Ge-on-Si photonic platforms and devices for the mid-infrared. We demonstrate low loss strip and slot waveguides in SOI and show efficient strip-slot couplers. A Vernier configuration based on racetrack resonators in SOI has been also investigated. Mid-infrared detection using defect engineered silicon waveguides is reported at the wavelength of 2-2.5 μm. In order to extend transparency of Si waveguides, the bottom oxide cladding needs to be removed. We report a novel suspended Si design based on subwavelength structures that is more robust than previously reported suspended designs. We have fabricated record low loss Ge-on-Si waveguides, as well as several other passive devices in this platform. All optical modulation in Ge is also analyzed.
A resonance-enhanced, defect-mediated, ring resonator photodetector has been implemented as a single unit biosensor on a silicon-on-insulator platform, providing a cost effective means of integrating ring resonator sensors with photodetectors for lab-on-chip applications. This method overcomes the challenge of integrating hybrid photodetectors on the chip. The demonstrated responsivity of the photodetector-sensor was 90 mA/W. Devices were characterized using refractive index modified solutions and showed sensitivities of 30 nm/RIU.
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