Old Web
English
Sign In
Acemap
>
authorDetail
>
Jason Goodelle
Jason Goodelle
Chip
Electronic engineering
Wafer
Capacitive sensing
Wafer-level packaging
2
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Cu Pillar Bump Design Parameters for Flip Chip Integration
2021
ECTC | Electronic Components and Technology Conference
Shengmin Wen
Jason Goodelle
VanDee Moua
Kenny Huang
Chris Xiao
Show All
Source
Cite
Save
Citations (0)
Development of Wafer Level Process for the Fabrication of Advanced Capacitive Fingerprint Sensors Using Embedded Silicon Fan-Out (eSiFO(R)) Technology
2019
ECTC | Electronic Components and Technology Conference
ShuYing Ma
Chengqian Wang
Fengxia Zheng
Daquan Yu
Hong Xie
Xiaobing Yang
Li Ma
Ping Li
Weidong Liu
Jambo Yu
Jason Goodelle
Show All
Source
Cite
Save
Citations (2)
1