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Cheng Zhong
Cheng Zhong
Huawei
Electronic engineering
Materials science
Composite material
Chip-scale package
Chip
2
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7
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Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method
2018
ECTC | Electronic Components and Technology Conference
Van-Lai Pham
Yuling Niu
Jing Wang
Huayang Wang
Charandeep Singh
Seungbae Park
Cheng Zhong
Sau Wee Koh
Jifan Wang
Shuai Shao
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Citations (3)
Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP
2018
Huayan Wang
Shuai Shao
Van-Lai Pham
Panju Shang
Cheng Zhong
Seungbae Park
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Citations (4)
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