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Hirohiko Endoh

Ricoh

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Mechanism of void formation in TiN/AlSiCu/TiN/plasma-enhanced tetraethyl orthosilicate SiO2 multi-layer structures via high-temperature stress migration

2018 Materials Science in Semiconductor Processing
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Copper wire bonding package decapsulation using the anodic protection method

2015 Microelectronics Reliability
- Hirohiko Endoh
- Takuya Naoe
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