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M. Mirgkizoudi

Loughborough University

8

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20

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Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

2015 Microelectronics Reliability
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Mechanical and interfacial characteristics of Zn-Al solder joints under elevated temperature and vibration conditions

2014 ESTC | Electronics System-integration Technology Conference
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Characterization of Cu-Sn SLID interconnects for harsh environment applications

2014 DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
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Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments

2013
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Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics

2012 Journal of microelectronics and electronic packaging
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Effects of combined thermal and vibration loadings on the wire bond integrity

2011 ICEPT | International Conference on Electronic Packaging Technology
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